Interconnect device and module using same

ABSTRACT

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

This application claims the benefit of U.S. Provisional Application No.61/826,941 filed May 23, 2013, entitled RESONATOR ASSEMBLY HAVINGDEFLECTABLE INTERCONNECT ELEMENT, the disclosure of which isincorporated by reference herein in its entirety.

BACKGROUND

Piezoelectric devices such as thin film bulk acoustic resonators (TFBAR)and similar technologies like quartz crystal microbalances (QCM) havebeen employed as mass detectors for some time. One application ofpiezoelectric resonators is in detecting very small quantities ofmaterials. Piezoelectric resonators used as sensors in such applicationsare sometimes called “micro-balances.” A piezoelectric resonator istypically constructed as a thin, planar layer of crystalline orpolycrystalline piezoelectric material sandwiched between two electrodelayers. When used as a sensor, the resonator is exposed to the materialbeing detected to allow the material to bind on a surface of theresonator.

The material to be detected is often an analyte. A binding partner(e.g., an antibody, etc.) that selectively binds the analyte may beimmobilized relative to a surface of the resonator. When the analyte iscontacted with the surface of the resonator, the mass on the surfaceincreases. The changed mass results in changes to the resonance phase,frequency, etc., of the resonator.

One conventional way of detecting the amount of the material bound onthe surface of a resonator is to operate the resonator as an oscillatorat its resonant frequency. As the material being detected binds on theresonator surface, the oscillation frequency of the resonator isreduced. This change in the oscillation frequency of the resonator,presumably caused by the binding of the material on the resonatorsurface, is measured and used to calculate the amount of the materialbound on the resonator or the rate at which the material accumulates onthe resonator's surface.

The sensitivity of a piezoelectric resonator in air as a material sensoris theoretically proportional to the square of the resonance frequency.See, e.g., G. Sauerbrey, Zeitschrift fur Physik 155 (2): 206-222. Thus,the sensitivities of material sensors based on the popular quartzcrystal resonators are limited by their relatively low oscillatingfrequencies, which typically range from several MHz to about 100 MHz.The development of thin-film resonator (TFR) technology can potentiallyproduce sensors with significantly improved sensitivities. A thin-filmresonator can be formed by depositing a thin film of piezoelectricmaterial, such as AN or ZnO, on a substrate. Due to the small thicknessof the piezoelectric layer in a thin-film resonator, which is on theorder of several microns, the resonant frequency of the thin-filmresonator is on the order of 1 GHz. The high resonant frequencies andthe corresponding high sensitivities make thin-film resonators usefulfor material sensing applications.

Regardless of the technology employed, electrical connections associatedwith piezoelectric resonator analyte measurement systems should besufficiently robust. Often such systems contain a module or cartridgethat includes the resonator and other circuitry and an associatedinstrument or apparatus that can receive the module or a portion thereofand that can operably couple to the resonator when the module isreceived by the associated apparatus. The associated apparatus mayinclude any suitable or desirable electrical components, such as a powersupply, processor, memory, signal generator, and associated circuitry(e.g., for producing a resonance wave), detection components andassociated circuitry (e.g., for detecting changes to the wave as aresult of analyte binding), etc. The memory may contain computerreadable instructions that cause the associated instrument to generate awave and detect changes in the wave. Examples of suitable circuitry andassociated devices are described in U.S. Pat. Nos. 5,932,953 and8,409,875, each of which is hereby incorporated herein by reference intheir respective entireties to the extent that they do not conflict withthe present disclosure.

SUMMARY

In general, the present disclosure provides various embodiments of aninterconnect device, and modules and systems that utilize such device.

In one aspect, the present disclosure provides an interconnect devicethat includes a printed circuit board (PCB). The PCB can include asubstrate that forms a resiliently deflectable element, a conductivematerial disposed on the substrate, and an electrical contact disposedon the resiliently deflectable element and electrically coupled to theconductive material. The interconnect device further includes aconnector that includes a connecting pin configured to electricallycouple with the electrical contact of the resiliently deflectableelement of the PCB and cause the resiliently deflectable element todeflect when the element contacts the connecting pin.

In another aspect, the present disclosure provides a resonator sensormodule that includes a module interface and a resonator electricallycoupled to the module interface. The module interface includes a printedcircuit board (PCB) that includes a substrate that forms a resilientlydeflectable element, a conductive material disposed on the substrate,and an electrical contact disposed on the resiliently deflectableelement and electrically coupled to the conductive material. Theresonator is electrically coupled to the conductive material.

In one or more embodiments, the resonator sensor module can be includedin a resonator sensor system for measuring binding kinetics of aninteraction of an analyte material present in a fluid sample. The systemalso includes a measurement apparatus operatively coupled to theresonator sensor module through an interconnect device that includes themodule interface of the resonator sensor module and a connector of themeasurement apparatus. The measurement apparatus includes actuationcircuitry configured to drive the resonator into an oscillating motion,measurement circuitry configured to measure a resonator output signalrepresenting a resonance characteristic of the oscillating motion of theresonator, and a controller operatively coupled to the actuation andmeasurement circuitry.

These and other aspects of the present disclosure will be apparent fromthe detailed description below. In no event, however, should the abovesummaries be construed as limitations on the claimed subject matter,which subject matter is defined solely by the attached claims, as may beamended during prosecution.

BRIEF DESCRIPTION OF THE DRAWINGS

Throughout the specification, reference is made to the appendeddrawings, where like reference numerals designate like elements, andwherein:

FIG. 1 is a schematic perspective view of one embodiment of aninterconnect device.

FIG. 2 is a schematic cross-section side view of the interconnect deviceof FIG. 1.

FIG. 3 is a schematic cross-section side view of the interconnect deviceof FIG. 1.

FIG. 4 is a schematic plan view of a first major surface of a printedcircuit board (PCB) of the interconnect device of FIG. 1.

FIG. 5 is schematic plan view of a second major surface of the PCB ofthe interconnect device of FIG. 1.

FIG. 6 is a schematic exploded view of a top surface of a connector ofthe interconnect device of FIG. 1.

FIG. 7 is a schematic perspective view of a bottom surface of theconnector of the interconnect device of FIG. 1.

FIG. 8 is a schematic perspective view of one embodiment of a resonatorsensor system.

FIG. 9 is a schematic exploded view of one embodiment of a resonatorsensor module.

FIG. 10 is a schematic plan view of a top surface of the resonatorsensor module of FIG. 9.

FIG. 11 is a schematic plan view of a bottom surface of the resonatorsensor module of FIG. 9.

FIG. 12 is a schematic diagram of another embodiment of a resonatorsensor system.

DETAILED DESCRIPTION

In general, the present disclosure provides various embodiments of aninterconnect device and modules and systems that utilize such device. Inone or more embodiments, the interconnect device can include a printedcircuit board (PCB) and a connector that is configured to electricallycouple with the PCB. Further, in one or more embodiments, the PCBincludes a substrate that forms a resiliently deflectable element, aconductive material disposed on the substrate, and an electrical contactdisposed on the resiliently deflectable element and electrically coupledto the conductive material. The connector can, in one or moreembodiments, include a connecting pin configured to electrically couplewith the electrical contact of the resiliently deflectable element ofthe PCB and cause the resiliently deflectable element to deflect whenthe element contacts the connecting pin. The resilient nature of thedeflectable element results in force being applied by the connecting pinto the deflectable element. In one or more embodiments, the force issufficient to cause a robust electrical connection between the contactof the deflectable element and the connecting pin. In one or moreembodiments, it has been found that by forming “fingers” from thecircuit board to form resiliently deflectable elements, sufficientlyrobust electrical connection may be made between the contacts of theresiliently deflectable elements and the associated apparatus. Such“fingers” or resiliently deflectable elements may be formed by slots orslits in the PCB.

As indicated herein, one or more sensors (e.g., resonators) may beassociated with a PCB. The sensor may be operably coupled with theconductive material of the PCB.

Any suitable PCB can be used to form one or more resiliently deflectableelements having one or more contacts. In one or more embodiments, thePCB includes one or more non-conductive substrates onto which electricalcomponents, conductive traces, contact pads or the like are disposed.The conductive traces, contact pads, etc. may be formed in sheets thatare laminated onto a non-conductive substrate or may be disposed on thesubstrate in any other suitable manner. Conductive materials on one sideof a substrate may be connected to conductive materials on another sideof the substrate through vias or through-holes formed in the substrate.If the PCB includes multiple layers, conductive materials disposed onone layer may be coupled to conductive materials on another layerthrough vias.

For example, FIG. 1 is a schematic perspective view of one embodiment ofan interconnect device 10. As illustrated in FIG. 1, the interconnectdevice 10 includes a printed circuit board (PCB) 12 and a connector 40.Any suitable PCB 12 and connector 40 can be utilized in the interconnectdevice 10.

In one or more embodiments, the interconnect device 10 can provide adurable connection that allows for two or more apparatuses, components,devices, or systems to be connected and disconnected multiple timeswithout compromising the integrity of the electrical coupling betweenthe apparatuses. Any suitable apparatuses, components, devices, andsystems can be electrically coupled utilizing the interconnect device 10as is further described herein. In one or more embodiments, the device10 can provide a sealed connection between components to preventexposure of the connection and internal circuitry of the components tovarious environmental elements, e.g., moisture, dirt, etc. Any suitabletechnique or combinations of techniques can be utilized to protect theinterconnect device from the external environment.

The interconnect device 10 can be disposed within one or more componentsin any suitable configuration. For example, in one or more embodiments,the PCB 12 can be disposed within a case or enclosure of one componentand the connector 40 can be disposed within a case or enclosure ofanother component.

The PCB 12 can include any PCB. For example, FIG. 4 is a schematic planview of a first major surface 18 of a substrate 14 of the PCB 12 of FIG.1, and FIG. 5 is a schematic plan view of a second major surface 20 ofthe substrate 14 of PCB 12.

The PCB 12 includes the substrate 14. The substrate 14 can include anysuitable material or combination of materials. In one or moreembodiments, the substrate can include electrically insulatingmaterials.

The substrate 14 forms resiliently deflectable elements 16. As usedherein, the phrase “resiliently deflectable element” refers to one ormore elements formed by the substrate of the PCB that can be deflectedone or more times by a connector to provide an electrical couplingbetween the PCB and the connector and return to their originalconfigurations and/or shapes when the elements are no longer deflectedby the connector. The resiliently deflectable elements 16 can be formedusing any suitable technique or combination of techniques.

Although FIGS. 1 and 4-5 illustrate that PCB 12 includes 5 resilientlydeflectable elements 16, the PCBs of the disclosure can include anysuitable number of resiliently deflectable elements, e.g., 1, 2, 3, 4,5, or more resiliently deflectable elements.

Each resiliently deflectable element 16 can provide one more electricalconnections or pathways between the PCB 12 and an associated apparatus.For example, in one or more embodiments, each resiliently deflectableelement 16 can provide a discrete channel or pathway between the PCB 12and an associated apparatus via the connector 40. As used herein, achannel refers to a discrete electronic pathway through which data orelectrical signals may be transmitted.

Further, each resiliently deflectable element 16 can include anysuitable dimension and shape or combination of shapes. For example, asillustrated, each resiliently deflectable element 16 has taken asubstantially rectangular shape. In one or more embodiments, theresiliently deflectable elements 16 can take a substantially squareshape, a curvilinear shape, etc. The resiliently deflectable elements 16can also have any suitable spacing between each element. Alternatively,in one or more alternative embodiments, one or more resilientlydeflectable elements 16 can be connected to an adjacent element so thatthere is no space between such elements.

Disposed on the substrate 14 is conductive material 22. Any suitablematerial or combination of materials can be utilized for conductivematerial 22. In one or more embodiments, the conductive material 22 maybe electrically conductive such that an electrical connection can beprovided between various components or devices disposed on the PCB 12and the connector 40 as is further described herein. In one or moreembodiments, the conductive material 22 is shaped or formed to provideconductive traces or transmission lines between various components ordevices provided on or associated with the PCB 12 and the connector 40.The conductive material 22 can also be formed to provide pads orcontacts 30 for electrically coupling one or more components or devices26, 28 to the conductive material 22.

The conductive material 22 can be disposed on one or both of the firstmajor surface 18 and second major surface 20 of substrate 14. Anysuitable technique or combination of techniques can be utilized to formthe conductive material 22 on the PCB 12. In one or more embodiments,conductive material 22 can be provided on both of the first and secondmajor surfaces 18, 20, and one or more vias or through-holes can beprovided through the substrate 14 to electrically couple conductivematerial 22 disposed on the first major surface 18 with conductivematerial disposed on the second major surface 20.

The PCB 12 also includes one or more electrical contacts 24 disposed onone or more of the resiliently deflectable elements 16. In general, theelectrical contacts 24 are electrically coupled to the conductivematerial 22 to provide an electrical pathway from one or more components26, 28 disposed on or associated with the PCB 12 to an associatedapparatus or system via the connector 40 as is further described herein.Although depicted as being disposed on each resiliently deflectableelement 16, the electrical contacts 24 can be provided on any suitablenumber of resiliently deflectable elements, e.g., 1, 2, 3, 4, 5, or moredeflectable elements. Further, any suitable number of electricalcontacts 24 can be disposed on an individual resiliently deflectableelement 16.

Electrical contacts 24 can be disposed on the resiliently deflectableelements 16 using any suitable technique or combination of techniques.In one or more embodiments, the electrical contacts 24 can be providedby forming one or more vias through an optional insulating layer 32 thatcan be provided on the conductive material 22 on the first major surface18, and/or a second insulating layer 36 provided on conductive materialprovided on the second major surface 20. Such vias can be formed on oneor both of the first major surface 18 and second major surface 20 of thePCB 12.

The electrical contacts 24 can be formed of the same or differentmaterial or combination of materials as the conductive material 22. Inone or more embodiments, the electrical contacts 24 are disposed on oneor both of the first and second major surfaces 18, 20 of the substrate14 when the conductive material 22 is formed. Further, the electricalcontacts 24 can be any suitable dimension and can take any suitableshape or combination of shapes.

As mentioned herein, the print circuit board 12 can also include theinsulating layer 32 disposed on the first major surface 18, and thesecond insulating layer 36 on the second major surface 20 of thesubstrate 14. Insulating layer 32 is not shown in FIG. 4. for clarity.The insulating layers 32, 36 can include any suitable material orcombination of materials that provide electrical insulation or isolationof the conductive material 22. Further, in one or more embodiments, theinsulating layers 32, 36 can also protect conductive material 22 fromthe external environment. In one or more embodiments, one or both of theinsulating layers 32, 36 can be disposed such that conductive material22 is between the insulating layers and the substrate 14.

The PCB 12 can include any other suitable features. For example, the PCB12 includes a slot or opening 34 that provides access to one or morecomponents as is further described herein. The PCB 12 can include anysuitable number of slots or openings for providing access to a componentfor various testing. As illustrated in FIG. 1, the PCB 12 also includesslot or opening 35 that can provide access to a component, e.g., forhematocrit sampling.

Further in one or more embodiments, the print circuit board 12 caninclude indicia for aligning the PCB in any suitable manufacturingprocess. For example, indicia can be provided on one or both surfaces18, 20 of PCB 12 to align the PCB for providing one or more integratedcircuit or electronic components on the PCB as is further describedherein. In one or more embodiments, the PCB 12 can include any suitablenumber of openings that can be utilized to attach the PCB to the casingor enclosure of an apparatus or device.

In one or more embodiments, one or more electronic components or devicescan be disposed on the PCB 12 such that they are electrically coupled toconductive material 22. For example, in one or more embodiments, one ormore components 26, 28 can be disposed on one or both of the first andsecond major surfaces 18, 20 of the PCB 12 and electrically coupled toconductive material 22. Any suitable electronic component or componentscan be disposed on the PCB 12, e.g., integrated circuits (e.g.,controllers, switches, memory, etc.), sensors (e.g., resonators, etc.).Such components can be electrically coupled to the conductive material22 using any suitable technique or combination of techniques. Further,such components can be electrically coupled to the PCB 12 using anysuitable conductive material. In one or more embodiments, components 26,28 can be electrically coupled to conductive material 22 throughconductive pads or contacts 30.

In one or more embodiments, each terminal of component 26 can beelectrically coupled to a discrete electrical contact 24, and eachterminal of component 28 can be electrically coupled to a discreteelectrical contact. In one or more alternative embodiments, one or moreterminals of an electronic component can be electrically coupled to thesame electrical contact. Further, in one or more embodiments, one ormore terminals of component 26 can be coupled to the same electricalcontact as one or more terminals of component 28.

The interconnect device 10 also includes connector 40. The connector 40of interconnect device 10 of FIG. 1 is illustrated in greater detail inFIGS. 6-7. FIG. 6 is a schematic exploded view of the connector 40, andFIG. 7 is a schematic perspective view of a bottom surface 46 of theconnector 40.

The connector 40 can be disposed within an enclosure or casing of anassociated apparatus as is further described herein. For example, theconnector 40 can be attached to a PCB or interface of such an associatedapparatus using any suitable technique or combination of techniques. Inone or more embodiments, posts 58 can be provided on one or both of atop surface 44 and the bottom surface 46 of a body 42 of the device 40.One or more shields 60 can also be provided that can connect theconnector 40 to ground on a circuit board of the associated apparatus.The shields 60 can be electrically coupled to one or more connectingpins 50 through a metal layer 57 that contacts such pins. The pins 50coupled to the shields 60 via metal layer 57 can provide a commonground. Pins 50 that are not electrically coupled to shields 60 can beisolated from the metal layer 57 using cutouts 56.

The connector 40 can also include a body 42 having an opening 45configured to receive the connecting pin 50. In one or more embodiments,the body 42 can include an opening 45 for each pin 50. In one or moreembodiments, the body 42 can include an opening 45 configured to receivetwo or more pins 50.

As illustrated in FIG. 6, the body 42 can include a first portion 47 anda second portion 49. The first portion 47 can, in one or moreembodiments, include an electrically insulative material. And the secondportion 49 can, in one or more embodiments, include an electricallyconductive material.

The first portion 47 of the body 42 can be configured to receive thesecond portion 49 such that the second portion sits within a recess 43in the first portion. The connector 40 can be assembled by placing thesecond portion 49 within the recess 43 of the first portion 47. Each pin50 can be positioned in an opening 45 in the body 42. In one or moreembodiments, the pin 50 can include two or more parts such that a firstpart is positioned within the body 42 and the second part is thenattached to the first part.

The connector 40 can be configured such that it provides a seal betweenthe connector and the PCB 12 when the connector and the PCB areelectrically coupled. For example, connector 40 can include a gasket 48around a periphery of the body 42 to isolate the electrical connectionbetween the PCB 12 and the connector when they are engaged.

The connector 40 includes one or more connecting pins 50. In one or moreembodiments, one or more of the connecting pins 50 can be fixed. As usedherein, the phrase “fixed connecting pin” refers to a pin or post thatremains fixed in place when contacted with a resiliently deflectableelement 16 of the PCB 12 of the interconnect device 10. Althoughillustrated as including 5 connecting pins 50, the connector 40 caninclude any suitable number of connecting pins, e.g., 1, 2, 3, 4, 5, ormore connecting pins.

The connecting pins 50 can take any suitable shape or combination ofshapes. Further, the connecting pins 50 can include any suitablematerial or combination of materials that provide an electrical pathwayfrom the PCB 12 to an apparatus associated with the connector 40.

The body 42 can take any suitable shape or combination of shapes. In oneor more embodiments, the body 42 can include a step to receive a gasketsuch that the connector 40 is sealed within the associated apparatus.Each connecting pin 50 can include a first end 52 and a second end 54.The first end 52 is configured to contact electrical contact 24 disposedon the resiliently deflectable element 16 of the PCB 12. The second end54 of the connecting pin 50 is configured to make an electricalconnection with a contact or pad of a PCB or other interface of anassociated apparatus.

Each connecting pin 50 is also configured to cause a resilientlydeflectable element 16 of the PCB 12 to deflect when the elementcontacts the pin 50. For example, FIGS. 2-3 are schematic cross-sectionside views of the interconnect device 10 of FIG. 1. FIG. 2 illustratesthe interconnect device 10 when the PCB 12 and the connector 40 arespaced apart. As can be seen in FIG. 2, the resiliently deflectableelements 16 of the PCB 12 are in a non-deflected state such that theresiliently deflectable elements are substantially parallel with a plane11 of the substrate 14 of the PCB. As used herein, the phrase“substantially parallel” means that a plane containing one or moreresiliently deflectable elements forms an angle with the plane 11 of thesubstrate 14 that is no greater than 5 degrees. In one or moreembodiments, the non-deflected states of the resiliently deflectableelements 16 are their relaxed states (i.e., the configuration theyassume under no external forces applied by contact with the connectingpins 50 of the connector 40). According to their resilient nature, theelements 16 may return substantially to their relaxed states after beingdeflected.

As seen in FIG. 3, the connecting pins 50 are configured to cause one ormore resiliently deflectable elements 16 to deflect when the elementcontacts the pin such that the resiliently deflectable element forms anysuitable angle θ with the plane of the substrate 14 of the PCB 12,thereby electrically coupling the PCB to the connector 40. For example,in one or more embodiments, the pin 50 is configured to cause one ormore resiliently deflectable elements 16 to deflect such that they forman angle θ of greater than 5°, greater than 10°, or greater than 15°with the plane 11 of the substrate 14 of the PCB 12. In one or moreembodiments, the angle θ between one or more of the deflectedresiliently deflectable elements 16 and the plane 11 of the substrate 14is no greater than 90°, no greater than 70°, no greater than 60°, or nogreater than 50°. In one or more embodiments, the connecting pin 50 cancause the resiliently deflectable element 16 to deflect in a range ofangles θ±90°, ±80°, ±70°, ±60°, ±50°, ±40°, ±30°, ±20°, ±10°, or ±5°. Ingeneral, the deflection caused by the connecting pin 50 is sufficient toelectrically couple the electrical contact 24 with the connecting pinwithout causing unwanted strain on the PCB 12, e.g., without causingcracking or fracturing of the PCB. While not wishing to be bound by anyparticular theory, the deflection of the resiliently deflectable element16 provides sufficient force between the electrical contact 24 and thepin 50 such that electrical coupling is maintained between the PCB 12and the connector 40.

Any suitable amount of force can be provided by the pin 50 to theresiliently deflectable element 16. In one or more embodiments, each pin50 can provide at least 2 oz of force to an associated element 16. Inone or more embodiments, each pin 50 can provide no greater than 10 ozof force to an associated element 16. In one or more embodiments, eachpin 50 can be provide 2-5 oz of force to an associated element 16.

Although not shown in FIGS. 1-7, the interconnect device 10 can includeany suitable alignment structure or mechanism such that the electricalcontact 24 of the PCB 12 can be aligned with a pin 50 of the connector40.

In general, the interconnect device 10 can be utilized with any suitabledevices, apparatuses, components, or systems to provide an electricalcoupling between two or more apparatuses. For example, FIG. 8 is aschematic perspective view of a resonator sensor system 100. In one ormore embodiments, the resonator sensor system 100 can be used formeasuring binding kinetics of an interaction of an analyte materialpresent in a fluid sample. The system 100 includes a resonator sensormodule 110 and an associated measurement apparatus 112 that isconfigured to receive the module at a module port 114.

As illustrated in FIG. 8, system 100 is a portable system that can beused for point-of-need diagnostic testing in the field. Although thesystem 100 is depicted as being portable, in one or more embodiments,the system can be utilized on a laboratory bench or in a more permanentconfiguration. Although not shown in FIG. 8, the system 100 can includedevices and circuitry for connection to the internet or otherwisetransferring information, such as one or more USB ports, wirelessconnection, or the like. In one or more embodiments, the system 100 isconfigured with a network interface device and associatedfirmware/drivers, which enable the system to automatically initiate aquery over a network to obtain calibration constants for the specificsensor module. This embodiment eliminates the need for maintainingcalibration data locally. Instead, when a new resonator sensor module isattached, the instrument determines the serial number associated withthe particular sensor module (using RFID, bar code scanning, etc.), anduses that information to form its query. The database having specificsensor calibration data may be stored on a server located at thelaboratory facility, or remotely (e.g., at the manufacturer's facility),in which case the network over which the query is placed is a wide areanetwork (WAN) such as the Internet.

The module port 114 is configured to receive the resonator sensor module110. In one or more embodiments, the module port 114 includes analignment structure (not shown) that aligns the resonator sensor module110 such that a contact (e.g., contact 24 of FIG. 1) of a resilientlydeflectable element (e.g., element 16 of FIG. 1) is aligned with aconnecting pin (e.g., pin 50 of FIG. 1) of a connector (e.g., connector40 of FIG. 1). Any suitable alignment structure can be utilized to alignthe resonator sensor module 110 with the measurement apparatus 112.

The resonator sensor module 110 can include any suitable resonatorsensor module or device, e.g., the resonator sensor modules described incopending and cofiled PCT Patent Application No. PCT/______ (AttorneyDocket No. 680.00010201) to Webster, entitled TWO PART ASSEMBLY. Forexample, FIGS. 9-11 are schematic views of one embodiment of a resonatorsensor module 200 that can be utilized with system 100 of FIG. 8. FIG. 9is a schematic exploded view of the resonator sensor module 200, FIG. 10is a schematic cross-section plan view of a top surface 226 of themodule, and FIG. 11 is a schematic cross-section plan view of a bottomsurface 228 of the module.

The resonator sensor module 200 includes a first portion 202 and asecond portion 204. The first portion 202 includes a channel 206 and asensor 208 on a printed circuit board (PCB) 210. The PCB 210 can includeany suitable PCB, e.g., PCB 12 of interconnect device 10 of FIG. 1.Further, module 200 can include any suitable sensor or sensors 208.

For example, in one or more embodiments, the sensor 208 can include oneor more resonators. The resonators described herein can be thin-filmresonators (TFRs). Thin film resonators can include a thin layer or filmof piezoelectric material deposited on a substrate, rather than using,for example, AT-cut quartz. The piezoelectric films typically have athickness of less than about 5 micrometers, such as less than about 2micrometers, and may have thicknesses of less than about 100 nanometers.In one or more embodiments, thin-film resonators may be preferredbecause of their high resonance frequencies and the theoretically highersensitivities. Depending on the applications, a thin-film resonator canbe formed to support either longitudinal or shear bulk-acoustic waveresonant modes. In one or more embodiments, the resonator is formed tosupport shear bulk-acoustic wave resonant modes as they can be moresuitable for use in a liquid sample.

Additional details regarding sensor devices and systems that may employTFRs are described, for example, in U.S. Pat. No. 5,932,953 issued Aug.3, 1999 to Drees et al., entitled METHOD AND SYSTEM FOR DETECTINGMATERIAL USING PIEZOELECTRIC RESONATORS; and U.S. Pat. No. 8,409,875issued Apr. 2, 2013, to Johal et al., entitled MEASUREMENT OF BINDINGKINETICS WITH A RESONATING SENSOR.

TFR sensors may be made in any suitable manner and of any suitablematerial. By way of example, a resonator may include a substrate such asa silicon wafer or sapphire, a Bragg mirror layer or other suitableacoustic isolation means, a bottom electrode, a piezoelectric material,and a top electrode.

Any suitable piezoelectric material may be used in a TFR. Examples ofsuitable piezoelectric substrates include lithium tantalate (LiTaO₃),lithium niobate (LiNbO₃), Zinc Oxide (ZnO), aluminum nitride (AlN),plumbum zirconate titanate (PZT) and the like.

Electrodes may be formed of any suitable material, such as aluminum,tungsten, gold, titanium, molybdenum, or the like. Electrodes may bedeposited by vapor deposition or may be formed by any other suitableprocess.

In one or more embodiments, the resonator 208 of module 200 can includea sensing resonator that includes binding sties for an analyte material,and a reference resonator that lacks any binding sites for the analytematerial as if further described in PCT Patent Application No.PCT/______ (Attorney Docket No. 468.00010201) to Webster, entitled TWOPART ASSEMBLY.

In one or more embodiments, the module 200 can include back-to-back PCBconfigurations utilizing two substantially different PCBs. In oneapproach, the resonator on one PCB is situated off-center while theresonator on the other PCB is centered. In this configuration, thereference and sensing resonators can still have sufficient distancethere-between to reduce cross talk between the two resonators. Inanother aspect of the present disclosure, the resonators on the two PCBsare constructed such that the back-to-back PCB configuration results inthe reference and sensing resonators being directly opposed.

In one or more embodiments, the sensing resonator is coated with adifferent material than a reference resonator depending upon thematerial to be detected. By varying the coating on the resonators, thedisclosed systems can allow universal use for various diagnostic testingof chemical and/or biological materials without changing any of theother system structural components. Sensors for resonance shiftdetection of chemical and/or biological materials effectively allow fastresponse times for the detection of the respective chemical and/orbiological material, in the field detection capabilities, small samplesizes, minimally trained individuals, low direct and indirect costs, andelectronically transmittable data.

Although not necessarily easily visible in FIG. 9, the PCB 210 includesa slot (e.g., slot 34 of PCB 12) in which at least the piezoelectriclayer of the sensor 208 sits. The first portion 202 also includes threedifferent adhesive films 212 a, 212 b, and 212 c. The adhesive films 212a, 212 b, and 212 c along with the channel 206 and at least a portion ofthe PCB 210 and sensor 208 form the fluidic pathway. This particularexemplary sensor assembly also includes a waste wick 214, which iswithin or in fluid communication with the fluidic pathway. The wastewick 214 can function to contain overflow fluid from the fluidicchannel. This particular exemplary sensor assembly also includes atleast one, and in this embodiment two hydrophobic vents 216. Thehydrophobic vents 216 function to provide a liquid stop for use inmetering and to prevent liquid ingress into the instrument when using anexternal pump.

The second portion 204 is circular and is configured to be rotatedaround a central point. The second portion 204 includes eight (8) wells(illustrated by well 218). The wells 218 in this exemplary embodimenthave a teardrop shape. Shapes such as a teardrop shape may provide anadvantageous use of space, but it should also be noted that othershapes, such as circular shapes for example could also be suitable. Itshould also be noted that there are portions of the housing of thesecond portion that do not include wells. The portion without a well canbe utilized to have a position for the introducer upon assembly of thefirst and second portion. It is noted that the empty well for theintroducer to be placed in upon initial assembly cannot be the sampleintroduction well because it has to be accessible for introduction ofthe sample. It should also be noted that this function could be servedby an additional empty well (instead of a void). In this particularembodiment, the wells are sealed with one portion or piece of material,e.g., a seal 220. In this exemplary embodiment, the seal 220 is made ofa metal foil. This particular embodiment of the seal 220 includes twoopenings that are positioned over the voids. These openings can allowadvantageous assembly with introducer placement.

This particular embodiment of a sensor assembly 200 also includes agasket layer 222. The gasket layer 222 can be made of any material thatis somewhat compliant (to allow for a gasket type of function), and insome embodiments, the gasket material does not absorb a sufficientamount of liquid. The gasket layer 222 can be advantageous because itcan function to seal the wells once they have been punctured by theintroducer. In some embodiments, the gasket layer 222 can be attached to(via adhesive for example), or formed integrally with the seal 220.

The resonator sensor module 200 may include various one or more flowpaths in fluid communication with the resonator across which a fluidsample containing analyte may flow. The flow paths may be incommunication with one or more reagents that may be drawn across thesurface of the resonator, with or without the analyte. The resonator maybe associated with the PCB 210. The resonator sensor module 200 alsoincludes an interconnect device 224 (e.g., PCB 12 of interconnect device10 of FIG. 1) for electrical coupling to an associated apparatus orsystem, e.g., apparatus 112 of FIG. 8.

Any suitable technique or combination of techniques can be used with thesystem 100 of FIG. 8 for detection of test material. For example, abulk-acoustic wave piezoelectric resonator can be used as a sensor todetect an analyte. Such resonators may be included in the resonatorsensor modules described herein, e.g., module 200. The resonatortypically includes a planar layer of piezoelectric material bounded onopposite sides by two respective metal layers that form the electrodesof the resonator. The two surfaces of the resonator are free to undergovibrational movement when the resonator is driven by a signal within theresonance band of the resonator. When the resonator is used as a sensor,at least one of its surfaces is adapted to provide binding sites for thematerial being detected. The binding of the material on the surface ofthe resonator alters the resonant characteristics of the resonator, andthe changes in the resonant characteristics are detected and interpretedto provide quantitative information regarding the material beingdetected.

By way of example, such quantitative information may be obtained bydetecting a change in the insertion phase shift of the resonator causedby the binding of the material being detected on the surface of theresonator. Such sensors differ from those that operate the resonator asan oscillator and monitor changes in the oscillation frequency. Rather,such sensors insert the resonator in the path of a signal of apre-selected frequency and monitor the variation of the insertion phaseshift caused by the binding of the material being detected on theresonator surface.

Any suitable molecular recognition component may be bound to the surfaceof a resonator. The molecular recognition component preferablyselectively binds to the analyte of interest. By way of example, themolecular recognition component may be selected from the groupconsisting of nucleic acids, nucleotides, nucleosides, nucleic acidsanalogues such as PNA and LNA molecules, proteins, peptides, antibodiesincluding IgA, IgG, IgM, IgE, lectins, antibody fragments, enzymes,enzymes cofactors, enzyme substrates, enzymes inhibitors, receptors,ligands, kinases, Protein A, Poly U, Poly A, Poly lysine, triazine dye,boronic acid, thiol, heparin, polysaccharides, coomassie blue, azure A,metal-binding peptides, sugar, carbohydrate, chelating agents,prokaryotic cells and eukaryotic cells.

The module interface 224 can include any suitable structure such thatthe interface can connect the module 200 to an associated apparatus. Inone or more embodiments, the interface 224 can include one or moreresiliently deflectable tabs or fingers 225 formed in the first portion202 of the module 200 such that the module is configured to engage aconnector (e.g., connector 40 of FIG. 1) of an associated device (e.g.,measurement apparatus 112). The fingers 225, in one more embodiments,are configured to interlock with the casing of the connector of theassociated device such that the module is securely connected to theassociated device.

Returning to FIG. 8, the system 100 includes measurement apparatus 112.The apparatus 112 is operatively coupled to the resonator sensor module110 through an interconnect device, e.g., interconnect device 10 ofFIG. 1. The interconnect device can include the module interface (e.g.,module interface 224 of module 200) of the resonator sensor module 110and a connector (e.g., connector 40) disposed within apparatus 112. Theinterconnect device can be sealed such that is protected from theenvironment when the resonator sensor module 110 is connected to theapparatus 112 via module port 114. Once detection and testing iscompleted, the module 110 can be detached from apparatus 112 and eitherreconditioned for additional testing or disposed of

In some embodiments, the apparatus 112 can include a data storage devicesuch as a ROM or flash EEPROM. The data storage device may serve to setup the instrument for specific market applications by including softwareor identification information that allows the instrument to understandthe particular use of the system 100 as it relates to the resonatorsensor module 110. For instance, the read-only memory may contain basicinformation or algorithmic instructions for the interpretive logic ofthe instrument that relates to the output signal of the module 110,which may serve to limit the system 100 to specific applications, suchas limited only to use in one of: veterinary applications, toxicologyapplications, drugs of abuse applications; GMO grain applications, forexample.

The data storage device can also contain sensor-type specificinformation such as the general frequency range or approximate resonancefrequency of one or more resonators of the module 110 as determinedduring post-production testing. This information could, for example,reduce sensor detection and calibration setup time when a new sensor iscoupled to an instrument. In a related embodiment, the data storagedevice contains lookup tables of calibration correction constants thatare indexed by lookup codes individually determined for the sensors atthe factory. In various other embodiments, the lookup code may besupplied via printed label, barcode label, or using a RFID tag.

In one or more embodiments, the module 110 can include a read-onlymemory (ROM) or small flash device having its own specific calibrationconstants specific to the individual sensor module. This data could besupplied based on factory calibration performed on a representativesample taken from the manufactured lot in which the individual module110 was fabricated. The various embodiments of resonator sensor modulesdescribed herein can be used with any suitable measurement apparatus toprovide a resonator sensor system for measuring the binding kinetics ofan interaction of an analyte material present in a fluid sample, e.g.,the apparatuses described in U.S. Pat. No. 8,409,875. For example, FIG.12 is a schematic diagram of one embodiment of a system 300 thatincludes a resonator sensor module 310 and a measurement apparatus 312.The resonator sensor module 310 can include any resonator sensor moduledescribed herein, e.g., module 200 of FIGS. 9-11. Module 310 includes amodule interface 330.

As illustrated, the measurement apparatus 312 is operatively coupled tothe resonator sensor module 310 through the module interface 330. Anysuitable interconnect device can be utilized to operatively couple themeasurement apparatus 312 to the module 310, e.g., interconnect device10 of FIG. 1.

The apparatus 312 includes actuation circuitry 350, measurementcircuitry 360, and a controller 370 operatively coupled to the actuationand measurement circuitry.

The actuation circuitry 350 is configured to drive a sensor (e.g.,sensor 26 of FIG. 4) of the module 310 into an oscillating motion as isfurther described herein. The actuation circuitry 350 can include anysuitable device or devices to drive the resonators in this manner, e.g.,synthesizers, independent current sources, independent voltage sources,voltage controlled oscillators (VCO), backward wave oscillators (BWO),and combinations thereof.

The actuation circuitry 350 is configured to drive the one or moresensors (e.g., resonators) at any suitable frequency or frequencies. Inone or more embodiments, the actuation circuitry 350 is configured todrive one or more sensors at its resonant frequency. In someembodiments, the actuation circuitry 350 is configured to drive onesensor at a first frequency and a second sensor at a second frequency.For example, the resonator sensor module 310 can include one or moresensing resonators and one or more reference resonators. The actuationcircuitry 350 would, therefore, be configured to drive the one or moresensing resonators at a first frequency and the one or more referenceresonators at a second frequency. In some embodiments, the firstfrequency is substantially equal to the second frequency. In otherembodiments, the first frequency is different from the second frequency.

The system 300 also includes measurement circuitry 360 configured tomeasure one or more resonator output signals representing a resonancecharacteristic of the oscillating motion of the one or more sensors ofmodule 310. Measurement circuitry 360 can include any suitable device ordevices to measure these output signals, e.g., gain/phase detectors,amplifiers, filters, analog-to-digital circuits (ADCs),digital-to-analog circuits (DACs), mixers, directional couplers, RFreceivers, and combinations thereof.

Also included in the measurement apparatus 312 of the embodimentillustrated in FIG. 12 is a controller 370. The controller 370 isoperatively coupled to the actuation circuitry 350 and measurementcircuitry 360. The controller 370 can include any suitable device ordevices, e.g., microprocessors, microcontrollers, field programmablegate arrays (FPGAs), analog control circuits, application specificintegrated circuits (ASICs), computers, and combinations thereof. Insome embodiments, the controller 370 can include a combination ofhardware and software, such as by a microprocessor system and a set ofinstructions to implement the controller's functionality. In one or moreembodiments, the controller 370 can be implemented as a combination ofthe two, with certain functions facilitated by hardware alone, and otherfunctions facilitated by a combination of hardware and software. Avariety of suitable microprocessor systems may be utilized including,without limitation, one or more microcontrollers, one or more digitalsignal processors, and the like, along with appropriate interfacingcircuitry, data storage, power conditioning system, etc., as needed toimplement the controller's functionality.

In one or more embodiments, the controller 370 is configured to performvarious measurement functions as are described further in U.S. Pat. Nos.5,932,953 and 8,409,875. For example, in some embodiments, thecontroller 370 is configured to detect introduction of a fluid sampleinto contact with at least one of the one or more sensing resonators ofmodule 310 based on detection of a characteristic change in the sensingresonator output signal, e.g., the resonant frequency of the one or moresensing resonators. And in some embodiments, the controller 370 isconfigured, in response to the detection of the introduction of thefluid sample, to initiate measurement of the binding kinetics of theanalyte material to the at least one of the one or more sensingresonators.

In one or more embodiments, the controller 370 is further configured tomonitor the one or more resonator output signals from a time referencebased on the time of occurrence of the characteristic change in theoutput signal. Further, in some embodiments, the controller 370 isconfigured to detect a step change in a resonant characteristic of atleast one of the one or more sensing resonators and at least one of theone or more reference resonators selected from the group consisting of:a frequency, a reflection or transmission phase angle, a reflection ortransmission amplitude, or any combination thereof. And in someembodiments, the controller 370 is further configured to determine ameasure of concentration of the analyte in the fluid sample based on thebinding kinetics.

The controller 370 is further configured to send a control signal to adevice (e.g., device 28 of FIG. 4). For example, the controller 370 canbe configured to send a control signal to a switch to position theswitch in either a first position or a second position. In one or moreembodiments, the first position of the switch operatively couples asensing resonator and the module interface 330, and the second positionoperatively couples a reference resonator and the module interface. Thecontrol signal is provided to the switch via the module interface. Anysuitable switches and circuitry can be utilized to operatively couplethe module interface 330 and one or more resonators of the resonatorsensor module 310, e.g., those described in PCT Patent Application No.PCT/______ (Attorney Docket No. 468.00050201) to Tischer, entitledRESONATOR SENSOR MODULE AND SYSTEM AND METHOD USING SAME.

All scientific and technical terms used herein have meanings commonlyused in the art unless otherwise specified. The definitions providedherein are to facilitate understanding of certain terms used frequentlyherein and are not meant to limit the scope of the present disclosure.

As used in this specification and the appended claims, the singularforms “a”, “an”, and “the” encompass embodiments having pluralreferents, unless the content clearly dictates otherwise.

As used in this specification and the appended claims, the term “or” isgenerally employed in its sense including “and/or” unless the contentclearly dictates otherwise. The term “and/or” means one or all of thelisted elements or a combination of any two or more of the listedelements.

As used herein, “have”, “having”, “include”, “including”, “comprise”,“comprising” or the like are used in their open ended sense, andgenerally mean “including, but not limited to”. It will be understoodthat “consisting essentially of”, “consisting of”, and the like aresubsumed in “comprising” and the like. As used herein, “consistingessentially of,” as it relates to a composition, product, method or thelike, means that the components of the composition, product, method orthe like are limited to the enumerated components and any othercomponents that do not materially affect the basic and novelcharacteristic(s) of the composition, product, method or the like.

The words “preferred” and “preferably” refer to embodiments of theinvention that may afford certain benefits, under certain circumstances.However, other embodiments may also be preferred, under the same orother circumstances. Furthermore, the recitation of one or morepreferred embodiments does not imply that other embodiments are notuseful, and is not intended to exclude other embodiments from the scopeof the disclosure, including the claims.

Also herein, the recitations of numerical ranges by endpoints includeall numbers subsumed within that range (e.g., 1 to 5 includes 1, 1.5, 2,2.75, 3, 3.80, 4, 5, etc. or 10 or less includes 10, 9.4, 7.6, 5, 4.3,2.9, 1.62, 0.3, etc.). Where a range of values is “up to” a particularvalue, that value is included within the range.

Any direction referred to herein, such as “top,” “bottom,” “left,”“right,” “upper,” “lower,” and other directions and orientations aredescribed herein for clarity in reference to the figures and are not tobe limiting of an actual device or system or use of the device orsystem. Devices or systems as described herein may be used in a numberof directions and orientations.

All references and publications cited herein are expressly incorporatedherein by reference in their entirety into this disclosure, except tothe extent they may directly contradict this disclosure. Illustrativeembodiments of this disclosure are discussed and reference has been madeto possible variations within the scope of this disclosure. These andother variations and modifications in the disclosure will be apparent tothose skilled in the art without departing from the scope of thedisclosure, and it should be understood that this disclosure is notlimited to the illustrative embodiments set forth herein. Accordingly,the disclosure is to be limited only by the claims provided below.

1. An interconnect device, comprising: a printed circuit board (PCB)comprising: a substrate forming a resiliently deflectable element; aconductive material disposed on the substrate; and an electrical contactdisposed on the resiliently deflectable element and electrically coupledto the conductive material; and a connector comprising a connecting pinconfigured to electrically couple with the electrical contact of theresiliently deflectable element of the PCB and cause the resilientlydeflectable element to deflect when the element contacts the connectingpin.
 2. The device of claim 1, wherein the connector further comprises abody^(,) having an opening configured to receive the connecting pin. 3.The device of claim 2, wherein he connecting pin is fixed.
 4. The deviceof claim 2, wherein the connector further comprises a gasket positionedaround a periphery of the body.
 5. The device of claim 1, wherein thePCB further comprises an insulating layer disposed such that theconductive material is between the insulating layer and the substrate.6. The device of claim 5, wherein he electrical contact comprises a viaformed through the insulating layer to the conductive material.
 7. Thedevice of claim 1, wherein the conductive material and electricalcontact are disposed on a first major surface of the substrate of thePCB.
 8. The device of claim 1, wherein the conductive material isdisposed on a second major surface of the PCB, and the electricalcontact is disposed on a first major surface of the substrate, whereinthe electrical contact is electrically coupled to the conductivematerial through one or more vias that extend through the substrate. 9.The device of claim 1, further comprising an electronic componentdisposed on a first major surface of the PCB and electrically coupled tothe conductive material.
 10. The device of claim 9, wherein theelectronic component comprises a sensor.
 11. The device of claim 10,wherein the electronic component comprises a resonator.
 12. The deviceof claim 11, wherein the resonator comprises a bulk acoustic waveresonator.
 13. The device of claim 12, wherein the bulk acousticresonator comprises a shear-mode bulk acoustic wave resonator.
 14. Thedevice of claim 11, wherein the device comprises a second resonator anda switch that operatively couples the resonator and the second resonatorto the conductive material.
 15. A resonator sensor module comprising amodule interface and a resonator electrically coupled to the moduleinterface, wherein the module interface comprises a printed circuitboard (PCB) comprising: a substrate forming a resiliently deflectableelement; a conductive material disposed on the substrate; and anelectrical contact disposed on the resiliently deflectable element andelectrically coupled to the conductive material; wherein the resonatoris electrically coupled to the conductive material.
 16. The module ofclaim 15, wherein the resonator comprises a bulk acoustic waveresonator.
 17. The module of claim 15, wherein the resonator comprises asensing resonator comprising binding sites for an analyte material and areference resonator that lacks binding sites for the analyte material.18. The module of claim 17, wherein the module further comprises aswitch comprising a first position that operatively couples the sensingresonator and the module interface and a second position thatoperatively couples the reference resonator and the module interface.19. A resonator sensor system for measuring binding kinetics of aninteraction of an analyte material present in a fluid sample,comprising: the resonator sensor module of claim 15; and a measurementapparatus operatively coupled to the resonator sensor module through aninterconnect device comprising the module interface of the resonatorsensor module and a connector of the measurement apparatus, wherein themeasurement apparatus comprises: actuation circuitry configured to drivethe resonator into an oscillating motion; measurement circuitryconfigured to measure a resonator output signal representing a resonancecharacteristic of the oscillating motion of the resonator; and acontroller operatively coupled to the actuation and measurementcircuitry.
 20. The system of claim 19, wherein the connectorelectrically couples the measurement apparatus to the module interfaceof the resonator sensor module, the connector comprising a connectingpin configured to electrically couple with the electrical contact of theresiliently deflectable element of the PCB and cause the resilientlydeflectable element to deflect when the element contacts the connectingpin.
 21. (canceled)